Open Journal Systems

Practical Research on Electroless Copper Plating Technology on Ceramic Surface

Zheng Liu

Abstract

Deposited electroless copper layer on ceramic matrix by using formaldehyde reduction copper plating system to complete DPC seed layer. Used orthogonal experiment, single factor analysis and other methods to optimize solution parameters, the optimum parameters of electroless copper plating bath are as follows: Cu SO4 8g/L, C4H4O6KNa·4H2O 40g/L, HCHO 10g/L, temperature 35 ℃and time 30min respectively. Adopted scotch tape, microstructure, composition analysis, temperature cycling test and a variety of other test methods to comprehensively analyze the performance of the electroless copper layer, it turned out that electroless copper has fine electrical and mechanical performance.


Keywords

Ceramic substrate ;DPC ;Electroless copper plating

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References

Wang N. , Hsu A. , Lim A. , et al. High brightness LED assembly using DPC substrate and Super MCPCB. Microsystems, Packaging, Assembly and Circuits Technology Conference, 2009. IMPACT 2009. 4th International. IEEE, 2009 : 199-202.

Qin Jian, Liu Zewen, Zhong Yan, Wang Taihong. Exposure characteristics of acrylate dry film photoresist and its application. Micro-nanoelectronics Technology, 2011, 48(7): 454-459.

Lin Jinjie, Wu Meizhu. PCB Electroplating Copper Technology and Development. Printed Circuit Information, 2009, 12(5): 32-37.

Shingubara S. , Wang Z. , Yaegashi O. , et al. Bottom-up fill of copper in high aspect ratio via holes by electroless plating. Electron Devices Meeting, 2003. IEDM'03 Technical Digest. IEEE International. IEEE , 2003: 6.3. 1-6.3. 4.

Zhang Wanli, Xuan Tianpeng, Wang Liang et al. Electroless copper plating on materials and applications. Electroplating and environmental protection, 2011, 31(4): 2-3.

Jiang Pei'an, Lu Yongbao, Jie Jie. Design and production of printed circuit boards. Beijing: Publishing House of Electronics Industry, 2012. 100-134.

Aschenbrenner R., Ostmann A., Beutler U., et al. Electroless nickel/copper plating as a new bump metallization. Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on, 1995, 18 (2): 334-338.

Wang H., Jia J. , Song H. , et al. The preparation of Cu-coated Al2O3 composite powders by electroless plating. Ceramics International, 2011, 37(7): 2181-2184.

Laine-Ma T., Ruuskanen P., Kortet S., et al. Electroless copper plating and surface characterization of thermoplastic PPO based printed circuit boards. Circuit World, 2009, 35(4): 22-30.

Zhang Min, Xuan Tianpeng, Sun Yanle et al. Study on the deposition rate of ceramic electroless copper plating and the appearance of coating. Electroplating and Finishing, 2011, 33(7): 5-9.

Mu D. , Jin Y. . Study of anodized Al substrate for electronic packaging. Journal of Materials Science: Materials in Electronics, 2000, 11(3): 239-242.

Chene O., Landolt D. . The influence of mass transport on the deposit morphology and the current efficiency in pulse plating of copper. Journal of applied electrochemistry, 1989, 19(2): 188-194.

Emekli U., West AC. Effect of pulse plating on copper nucleation onto Ru. Electrochimica acta, 2009, 54(4): 1177-1183.[43] Yung KC , Yue TM , Chan KC , et al The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture. Electronics Packaging Manufacturing, IEEE Transactions on, 2003, 26(2): 106-109.

Rivera I. , Roca A. , Cruells M. , et al. Study of silver precipitation in thiosulfate solutions using sodium dithionite. Application to an industrial effluent. Hydrometallurgy, 2007, 89(1): 89-98.

Zarkadas G. M. , Stergiou A. , Papanastasiou G. . Influence of citric acid on the silver electrodeposition from aqueous Ag NO3 solutions. Electrochimica acta, 2005, 50(25): 5022-5031.

Pan Jimin. The improvement of electroplating skills must be read. Beijing: Mechanical Industry Press, 2011. 146-148.

Yang C. T. , Liu W. C. , Liu C. Y. . Measurement of thermal resistance of first-level Cu substrate used in high-power multi-chips LED package. Microelectronics Reliability, 2012, 52(5): 855-860.

Yang Jiansheng, Xu Yuanbin. Effect of surface properties on solderability of PBGA soft gold wire bond points. Electronics and Packaging, 2008, 1(1): 29-33.

Heo Y. J. , Kim H. T. , Nahm S. , et al. Ceramic-metal package for high power LED lighting. Frontiers of Optoelectronics, 2012, 5(2): 133-137.


DOI: http://dx.doi.org/10.18063/jcra.v1i1.779
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