2018: Volume 1 , No 1

Table of Contents

Articles

by Dongling Xiong
5 Views, 28 PDF Downloads

A new palladium-free activation technology for ABS plastic electroless copper plating is proposed. The plastic substrate is pretreated, and then placed in an activating solution prepared by mixing copper sulfate and sodium hypophosphite for 30 minutes. The plastic substrate is dried to form an activation layer at the surface, which is then uniformly scanned with a laser to allow the hypophosphite ions to be reduced into catalytically active copper particles. The effects of the formation of the activating solution and the laser parameters on the activation are studied. The parameters are optimized by using the orthogonal test. The microstructure of the coating is observed by scanning electron microscope. The energy spectrum of the substrate after laser activation is analyzed. Impact test is processed for coating binding detection. The results show that when the concentrations of copper sulphate and sodium hypophosphite are 10g/L and 30g/L respectively, and the laser spot diameter is 2mm and the scanning rate is 2.2mm/s, the coating completely covers the substrate and the surface of the substrate is uniformly coated with copper particles, showing compact microstructure and good binding.

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Articles

by Chelin Wang
6 Views, 13 PDF Downloads

In the context of the continuous strengthening of China's comprehensive national strength, a large number of technical personnel have been trained, and various new technologies have also been developed rapidly. In the past, people engaged in chemical engineering not only need to do chemical experiments with high difficulty and danger, but also deal with complex experimental data, which not only aggravated the burden of researchers, but also wasted time and resources.So the study of Chemical Technology in China need to continue to reform and innovation, MATLAB is an innovative and efficient software, can handle a variety of complex data, thereby greatly reducing the workload of the researchers, now in various experiments of chemical engineering has been widely used.This paper will analyze and study the important role of MATLAB in the data processing part of chemical experiment.

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Articles

by Han Jiang
8 Views, 12 PDF Downloads

Layered double hydroxides ( LDH) are a class of ionic lamellar compounds made up of positivelycharged layered hydroxides w ith an inter layer region containing charge compensating anions. LDH can beintroduced as precursor into polymer matrix to prepare LDH / polymer nanocomposites. The properties of thepolymer matrix can be strengthened as the addition of LDH,and nanocomposites have show n excellentperformances and development potentials in many fields.In this paper,the preparation methods of LDH / polymer nanocomposites are review ed,such as blending ,intercalation,in-situ,exfoliation / adsorption,layer-by -layer( LBL) assembly. Then the applications of the LDH/polymer nanocomposites are also summarized,such asflame retardant,gas barrier,infrared absorption,controlled release,adsorption. Finally ,development trends ofresearch direction and research field of the LDH / polymer nanocomposites are prospected.

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Articles

by Xinnang Lang
11 Views, 20 PDF Downloads

With the continuous improvement of chip power, the area is shrinking and the integration is getting higher and higher. The LED package puts higher requirements on the heat dissipation substrate. Direct plated copper (DPC) is fabricated on a ceramic substrate by a thin film process. It has stable chemical properties, high thermal conductivity, fine wiring, and a coefficient of thermal expansion (CTE) matching the chip material. The important development direction of power LED package heat sink substrate. However, due to the high price of DPC substrates, there is no corresponding quality and testing standards, which limits its application in high-power LED packaging. In this thesis, electroless copper plating on ceramic surface is used as the seed layer of DPC substrate, which reduces the costly equipment and process such as magnetron sputtering, and reduces the manufacturing cost of DPC substrate. Pulse plating instead of DC plating thickens the copper layer line, which not only improves the efficiency. At the same time, the quality of the coating is optimized; the silver layer is replaced by the gold layer as the soldering layer and the protective layer to reduce the material cost; and compared with other types of ceramic substrates, some test methods for the performance of the DPC substrate are proposed to further standardize the DPC substrate quality standard. Explored. The relationship between the current density of pulse copper plating and the plating rate was analyzed. The results show that the two are proportional to each other within a certain range. At the same current density, pulse plating can significantly reduce the formation of the tumor-like structure and optimize the quality of the coating compared to DC plating. The current density of 3ASD not only improves the plating efficiency, but also obtains a well-formed circuit layer.

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Articles

by Zheng Liu
9 Views, 25 PDF Downloads

Deposited electroless copper layer on ceramic matrix by using formaldehyde reduction copper plating system to complete DPC seed layer. Used orthogonal experiment, single factor analysis and other methods to optimize solution parameters, the optimum parameters of electroless copper plating bath are as follows: Cu SO4 8g/L, C4H4O6KNa·4H2O 40g/L, HCHO 10g/L, temperature 35 ℃and time 30min respectively. Adopted scotch tape, microstructure, composition analysis, temperature cycling test and a variety of other test methods to comprehensively analyze the performance of the electroless copper layer, it turned out that electroless copper has fine electrical and mechanical performance.

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