Editorial Team

Editorial Board Member

Olufemi Adebayo Johnson   Mail
Heriot-Watt University Malaysia
Malaysia
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Ayman Abdelsalam Elzohairy   Mail
University of Missouri
United States
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Heitor Luiz Ornaghi Júnior   Mail
UFRGS
Brazil
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Leila Soufeiani   Mail
University of Melbourne
Australia
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Wenkun Zhu   Mail
Southwest University of Science and Technology
China
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Mandeep Singh   Mail
Indian Institute of Technology, Roorkee
India
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Jacek Górka   Mail
Silesian University of Technology
Poland
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Ilaria Cacciotti   Mail
University of Rome Niccolò Cusano
Italy
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Weichen Xue   Mail
Tongji University
China
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Martin I. Pech-Canul   Mail
CINVESTAV IPN-SALTILLO
Mexico
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Jan Awrejcewicz   Mail
Lodz University of Technology
Poland
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Mohamad El Asswad   Mail
Paris Saclay University/UVSQ
France
Karima El Azhary   Mail
University Mohammed V of Rabat
Morocco
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Rohola Rahnavard   Mail
Jundi-Shapur University of Technology
Iran, Islamic Republic of
Xiongqi Peng   Mail
Shanghai Jiao Tong University
China
Hamdi Temel   Mail
Dicle University
Turkey
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Mohammad Iqbal Kkan   Mail
King Saud Uinversity
Saudi Arabia
Pi-Guey Su   Mail
Chinese Culture University
Taiwan, Province of China
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Irshad Ahmad Khan   Mail
SIRT,Bhopal
India
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Mohd Arsalan   Mail
Aligarh Muslim University
India
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Alireza A. Chiniforush   Mail
University of New South Wales
Australia
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Angelos Filippatos   Mail
Institute of Lightweight Engineering and Polymer Technology (ILK)
Germany
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Lúcia Maria de Jesus Simas Dinis   Mail
Faculdade de Engenharia da Universidade do Porto
Portugal
RENUGA VELAYUTHAM   Mail
National College
India
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Alexander Martin Matz   Mail
Pforzheim University
Germany
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Maria Ileana Pop   Mail
Technical University of Cluj Napoca
Romania
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Muhammad Shoaib Butt   Mail
National University of Science and technology(Nust)
Pakistan
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ANTONIO FORMISANO   Mail
UNIVERSITY OF NAPLES FEDERICO II
Italy
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Bin Xu   Mail
Institute of Vibratrion Engineering
China
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Changqing Hong   Mail
Harbin Institute of Technology
China
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Danièle Waldmann-Diederich   Mail
University of Luxembourg
Luxembourg
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DEEPAK RAWTANI   Mail
GUJARAT FORENSIC SCIENCES UNIVERSITY
India
Shailendra Singh Rajput   Mail
Ariel University
Israel
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Chin-Hsiang Cheng   Mail
National Cheng Kung University
Taiwan, Province of China
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DHRUBA JYOTI MAJUMDAR   Mail
TAMRALIPTA MAHAVIDYALAYA TAMLUK, PURBAMEDINIPUR, WEST BENGAL, INDIA
India
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Guoqing Chen   Mail
Dalian University of Technology
China
Shouyin Yang   Mail
National Formosa University
Taiwan, Province of China
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Lingyun Wang   Mail
School of Chemistry and Chemical Engineering, South China University of Technology
China
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Lizhong Jiang   Mail
Central South University
China
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Akin Akinci   Mail
SAKARYA UNIVERSITY
Turkey
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NEERAJ DWIVEDI   Mail
"NATIONAL UNIVERSITY OF SINGAPORE"
Singapore
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Reza Taherian   Mail
Shahrood University of Technology
Iran, Islamic Republic of
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Salim Hiziroglu   Mail
Oklahoma State University
United States
Shun-Tong Chen   Mail
National Taiwan Normal University
Taiwan, Province of China
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Dr. Venkata Sreenivas Puli   Mail
Smart Nanomaterials Solutions
United States
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VISHNU PRASAD   Mail
NATIONAL INSTITUTE OF TECHNOLOGY, CALICUT
India
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Wenchun Jiang   Mail
China University of Petroleum (East China)
China
Wen-Jing Zhou   Mail
Shanghai University
China
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Yao-Feng Chang   Mail
Micron Technology Inc
United States
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Bingtao Tang   Mail
Dalian University of Technology
China
Vishal Gangadhar Naranje   Mail
Birla Institute of Technology, Pilani Dubai Campus
United Arab Emirates