Open Journal Systems

A new laser assisted palladium-free activation technology for ABS plastic surface electroless copper plating

Dongling Xiong

Article ID: 775
Vol 1, Issue 1, 2018, Article identifier:

VIEWS - 385 (Abstract) 486 (PDF)


A new palladium-free activation technology for ABS plastic electroless copper plating is proposed. The plastic substrate is pretreated, and then placed in an activating solution prepared by mixing copper sulfate and sodium hypophosphite for 30 minutes. The plastic substrate is dried to form an activation layer at the surface, which is then uniformly scanned with a laser to allow the hypophosphite ions to be reduced into catalytically active copper particles. The effects of the formation of the activating solution and the laser parameters on the activation are studied. The parameters are optimized by using the orthogonal test. The microstructure of the coating is observed by scanning electron microscope. The energy spectrum of the substrate after laser activation is analyzed. Impact test is processed for coating binding detection. The results show that when the concentrations of copper sulphate and sodium hypophosphite are 10g/L and 30g/L respectively, and the laser spot diameter is 2mm and the scanning rate is 2.2mm/s, the coating completely covers the substrate and the surface of the substrate is uniformly coated with copper particles, showing compact microstructure and good binding.


ABS plastics; surface; laser activation; electroless copper plating

Full Text:


Included Database


LIU Z, XIAO S H, LIN Y B. Investigation of palladium-free activation process for electroless nickel plating of ABS plastic[J]. Materials Protection, 2006, 39(11): 29-31.

LI L B, AN M Z,WUG H. Electroless plating on plastic[J]. Electroplating&Pollution Control,2004,24 C3):1-4.

GUO Z W. Study on technology and performance of Ni-W plating on ABS plastic surface[J]. Guangzhou:Guangdong University of Technology, 2008.

SHU Z, WANG X. Environment-friendly Pd free surface activation technics for ABS surface[J]. Applied Surface Science,2012, 258 (14 ) : 5328-5331.

LIU Z, XIAO S H, LIN Y B. Investigation of palladium-free activation process forMaterials Protection,electroless nickel plating of ABS plastic[J]2006, 39(11): 29-31

WANG M Q, YAN J, DU SGPreparation and activation mechanismof electroless nickel plating on poly (vinyl chloride ) by palladium-free activation[J]. Journal of Central South University ( Science andTechnology), 2013, 44(10): 4019-4025.

HUANG J, LIU X X, WU C. A novel technology for palladium-freeelectroless nickel plating of ABS plastics[J]. Materials Protection,2009, 42 C4): 21-23.

PING Y Q, JIANG h Y Experimental studies about purlsed lasermodified polyurethane surface chemical copperplating withoutpalladium[J]. Engineering Plastics Application, 2015 (3):54-59.

FORMANEIL F, TAILEYASU N, TANAILA T, et al. Selectiveelectroless plating to fabricate complex three-dimensional metallicmicro/nanostructures[J]. Applied Physics Letters, 2006, 8808): 2768.

ZHOU H Y Research on rapid mold manufacturing technology basedon laser induced chemical liquid phase deposition[C]//2005 MoriSeiki International Mold Technology Conference, 2005.

ZHANG B G, TANG X J, CAS)M, et al. A new process withoutpalladium activation on ABS plastic surface:CN101067206[P].2007-11-07.

DING J, LU X B, ZAN L X, et al. Study on chromium-freeroughening with manganese dioxide for ABS engineering plasticsurface[J].Electroplating&Finishing,2012, 31 C6): 27-30.

(385 Abstract Views, 486 PDF Downloads)


  • There are currently no refbacks.

Copyright (c) 2018 Dongling Xiong