Machining millimeter-scale deep holes in SiCf/SiC material using femtosecond laser filamentation effect
Vol 2, Issue 3, 2018, Article identifier:
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DOI: http://dx.doi.org/10.18063/msacm.v2i1.748
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Copyright (c) 2018 Jie Zhao 1,2, Wenjun Wang 1,2, Ruijia Wang 1,2, Jianlei Cui 1,2

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